Tuesday, December 4, 2007

New Zune 2 teardown

We have got images of the new Zune 2 80GB player from Microsoft, courtesy of Rapid Repair.
We see a better designed product, not just a reference design transcription like Zune 1. The processor is now an i.MX32 instead of the i.MX31. There is very little information of this processor in the Freescale Web, only a block diagram. It seems to be very similar to the i.MX31, but with SRAM memory inside the chip and a better hardware multimedia player. As the i.MX31, it is an ARM1136JF 532MHz with floating point processor.
You can see the main board in this photograph:



- U1 is the dynamic RAM memory, in this case a Mobile DDR 512Mbit (64MByte) 32bit bus, from Hynix (old Hyundai). You can find the datasheet here.

- U2 is a Hi-speed USB Transceiver from SMSC, the USB3316B-CP. You can find the datasheet here.

- U3 is a DC/DC boost converter 1.8A 3.3V from Texas Instruments, exactly the TPS63001DRC. You can find the datasheet here.

- U4 is a 250mA Low dropout regulator from Texas Instruments, exactly the TPS73201. You can find the datasheet here.

- U5 is the i.MX32 ARM1136JF 532MHz processor. You can find the block diagram here.
- U6 is a power manager with audio codec from Wolfson, the WM8350. You can find a data brief here.
- U7 is a Flash memory from ST. There is no more information about it.

These are the only identified integrated circuits till now. If we get better images we can identify more circuits.
See you.

Wednesday, October 3, 2007

New Samsung ARM Processor User Manual



The brand new Aplication Processor from Samsung is ready to get into production. Samsung is now sampling it to certain customers.

For those of you that can't wait to read more about this powerful chip, follow this link and get the full user manual/datasheet:

Rapidshare download link

Although in a lot of websites, you could read that is the processor in the iPhone, that is not true. The footprint, the peripherals and the memory map are different. For example, the S3C6400 doesn't have the PowerVR MBX 3D processor.

It is not the same chip that goes in the iPhone but is very similar: same core and some common peripherals. It has a powerful ARM1176JZF-S at 533MHz with H.264 video aceleration, TFT and TV output, USB OTG 2.0 HS and a NAND Flash controller able to boot directly from NAND Flash, among its features.

Looking for see it in new interesting devices for the beginning of this new year.

In 2009, the ARM Cortex-A8 processors and the new Intel, x86 based, PC-on-a-chip Moorestown platform, will fight for the new portable gadgets and the Mobile Internet Device (MID) category of devices.

Friday, September 14, 2007

Teardown iPod Nano 3G

Just some days after the official presentation of the iPod Nano 3G, we have the first inside photos, courtesy of iFixit.

The design has less chips than previous versions of iPod Nano. The main processor is a Samsung S5L8702 (the iPod Nano 2G uses a S5L8701), probably with an ARM9 core.

The RAM comes from Qimonda (the spin-off from Infineon (the spin-off from Siemens) ). It is a 256Mbit (32MByte) Mobile 1.8V DDRAM, code HYE18M169CX75. Here is the datasheet.

There is also an audio codec, Apple branded, and a power manager chip also mark with an Apple code. There is no wheel controller; I suppose it is integrated in the power management chip.


On the other side of the board we can find the 8GByte NAND-Flash part, from Samsung: K9HCG08U5M, the same than in the iPhone. It is a multidie part (4 dies).

There is no NOR boot flash. I suppose that the processor is able to boot directly from Nand Flash.

Sunday, July 22, 2007

S3C6400 processor

The iphone processor is from Samsung and it is an ARM1176 core, similar to the general use Samsung processor S3C6400.
Here you have the first two pages of the S3C6400 datasheet, for you to have an idea of how the iphone processor could be:

Wednesday, July 11, 2007

New data about Samsung iphone processor

The Samsung processors site has just changed. Now there is two interesting documents:

- The mobile solution brochure, with a bit more data than before about S3C6400.

- The SoC part number decoder, interesting information about Samsung processors part numbers.

Another interesting link shows the photograph of the S3C6400, that shows the marking on it:

Click to see it better. The marking is S5I3000X01. Following the part number decoder document:
S System LSI
5 Large clasification: MOS
I Small clasification: Digital core
3000 Serial number
X First version
01 Mask number

Following this clasification, the numbering in the iphone die is:
S System LSI
5 Large clasification: MOS
L Small clasification: optical?
8900 Serial number
B Version B
01 Mask number

Also, you could see in the photograph the two rows of balls, up and around the chip, where the PoP (package on package) memory to make a multichip package is soldered (see main post).

I think that, following the Samsung rules (the MCP for S3C2440 with more features is SC32442), the real part number of the processor if it ends as general purpose product could be something like: SC36402 (the MCP version of the S3C6402, which is the S3C6400 with little changes, like the PowerVR MBX 3D processor).

Thursday, July 5, 2007

Inside iPhone (complete hardware analysis on progress...)

Al least, we have the iPhone, and there was several sites in the Internet opening the phone and showing photos of the boards. At the same time, other sites are already working on the firmware code.

The best hardware work was done by the guys of Semiconductor Insights. They even decap the chips to see the die markings. iFixit show more photographs of the iphone progresive teardown.
There is additional PCB and chip dies scans in Microblog, the best quality ones.

Here, as an electronics engineer, I will try to pick all this information, and make a guess of the complete iphone hardware specification. This specification will evolve with uncoming informations and hints from other people. If you have additional information or have an opinion I would like to read you in the comments of by a private e-mail to mailto:InsideTronics@gmail.com.

iPhone Hardware Specs:

The main electronics are splitted into two boards.

- The main processor board:
The main processor it is a stacked die package with a processor marked as S5L8900 and two 512Mb DRAM dice (128MBytes of DRAM). This configuration is normal in a mobile. Normally the main processor has pads in the upper part of the sustrate to solder a PoP (package on package) multidie chip. The layout of the pads is a Jedec standard (JC63 and JC11) and this allows to save space but at the same time use the preferred memory supplier.The DRAM MCP (multichip package) is the K4X1G153PC-XGC3 from Samsung that, according to the Mobile DDRAM part number decoding from Samsung has the following characteristics:

DDR-SDRAM, 1Gbit, 8K blocks, 64ms, 1.8V core, 1.8V I/O, x16 bits bus, 4 banks, C generation, FBGA, Extended low temperature, speed 7.5ns@CL3.

Now the processor. This is the most difficult part. Semiconductor Insights says that the die number is S5L8900. You could even see the number 8900 in the chip marking. In the past, several Samsung chips has this kind of numbering. Last iPod processor is the S5L8701 (8701 in the marking), and in the Samsung web site you could see a ARM9 MP3 player processor named as S5L8700. I think it is clear that the processor is a Samsung part.

In Microblog, Nick Chernyy has decap the CPU chip and he has a clear photo of the die marks.



People has already found in the firmware strings, that the processor is a ARM1176. With this ARM core, Samsung has only one processor in the web site: the brand new S3C6400. I have found the S3C6400 datasheet in the Internet (it is not an easy task) and I have read it. This is the block diagram of this processor:


But I'm afraid this is not the real processor in the iphone. I think it is a propietary design for Apple. One of the reason is that the firmware interrupts (from some info found in the Internet) doesn't match with the datasheet, and the blocks declared in the firmware are similar but not identical to the S3C6400. In the firmware there is also declarations that shows that there is a PowerVR MBX 3D processor from Imagination Technologies inside the S5L8900.

I think that is a similar design, with a multiformat hardware video accelerator(MPEG4, H.264, etc.), PowerVR 2D and 3D accelerator, NAND Flash booting feature, USB OTG 2.0, and ARM1176J2F core, and no more DSP capabilities (with ARM11 cores nobody use a DSP anymore, except for video).

The third chip in this board is the NAND flash. It is a part also from Samsung: K9MCG08U5M
It is a 8GByte chip, with four 2GByte dies stacked. In the 4Gbyte iphone version, the chip is the K9MCG08U1M, that is a 4GByte, dual die part.

In the other side of the digital board there is a small integrated circuit from SST, marked as SST39WF800A. It is a 2MByte (8Mbit x 16) 1.8V NOR Flash. The processor boots from this flash memory.

The Intel NOR flash in the other board is for the baseband Infineon controller. It is not feasible to use the NOR flash through the connector between the two boards.

The fourth chip is the I2S voice codec from Wolfson: WM8758. A very good sound quality part, indeed, the same than in last iPod.

The USB battery charger, from Linear Technology LTC4066, is also a good part.

Other chip is a LVDS 24 bit driver from National (LM2512SM) to carry the signals to the display with less wires and without interference.

The remaining chip, from NXP (Philips before), I guess it is the power manager with the switching power supplies (see the coils near the chip, with capacitors and schottky diodes). In the firmware there is references to the PCF50635 power manager. Must be this part or similar.

- The radio board:
The radio board has the following circuits:

The baseband processor is an Infineon PMB8876 S-Gold multimedia engine with EDGE functionality. Comes with an Intel NOR Flash + SDRAM PF38F1030W0YTQ2 (4Mbytes NOR + 2Mbytes PSRAM) to run the baseband code (the capacities in the Semiconductor Insights article are wrong, see the datasheet link).

The RF GSM transceiver is an Infineon part, probably the M1817A11.

The bluetooth chip cames from CSR (Cambridge Silicon Radio): the Bluecore4.

The Wifi is a Marvell part: the 88W8686.

- Other parts:

The touchscreen is from German manufacturer Balda.

In the touchscreen there is a SPI multitouch controller from Broadcom, the BCM5973A.

The camera has a Micron 2Mpixel sensor, probably MT9D112D00STC.

The display is 320x480, can be a Samsung or AUO module.

The battery is a Li-IonPolymer 3.7V.


More will follow...

PD. Changes 6/7/2007: PowerVR 3D reference included, changed capacity values in Intel Flash/PSRAM.
Changes 19/7/07: Die photo of processor included.
Changes 21/7/07: Microblog scans reference added.
Changes 6/8/07: SST NOR Flash memory reference added.