We have seen the first teardown photos of the brand new Nintendo DSi games console, courtesy of Bunnie.
In the mainboard, we can see the following circuits:
uPD 46128512AF1 Its a Mobile RAM of 128Mbit, 16 bit, as we can see in the NEC web:
46 Mobile RAM
512 16 bit
A Revision A
F1 Plastic BGA (Wire bonding)
There is even a datasheet of the 64Mbit part.
Its a DDR RAM but with a SRAM interface. This simplifies the ARM CPU, that doesn't need a dynamic RAM controller.
The NAND chip also includes the controller. It is a SAMSUNG MOVI NAND circuit, that presents a MMC interface to the host, also simplifing the ARM CPU. The capacity is 256Mbytes and the bus width 8 bits.
Doing part number decoding we have:
KM MOVI NAND
A NAND + MCU
P 256 Mbytes 8bits bus
In the bottom left corner we have a chip without chipmaker identification. It is marked as: PAIC3000D. The name is similar to the TI codecs: AIC3, and it is near the earphone connector. I suposse that it is the sound codec chip.
In the right corner the chip from Mitsumi (MM3317A) seems to be the power supply + charger circuit. There is no clues in the Mitsumi web page.